Clemson University Presents its 2007 International Conference on Micromanufacturing

ICOMM 2007

ICOMM 2007 photo

 Call for Papers

Authors will be notified of acceptance by
April 2, 2007
.

Final manuscripts must be submitted by
July 24, 2007
.


 

Welcome to ICOMM 2007

2007 International Conference on Micromanufacturing  

Clemson University Presents its 2007
International Conference on Micromanufacturing

Manufacturing at the micro-scale (a few microns to a few millimeters) is a key technology that will bring about different ways people & machines interact with the physical world. Practical application of miniaturization technologies may be found in optics, bio-technology, electronics, medicine, communications, and avionics to name a few. These applications use a wide range of engineering materials, 3D features and high relative accuracies (10-3–10-5). As such, new processes and new equipment are being developed to meet needs that can not be met via conventional lithography-based techniques. ICOMM 2007 will focus on new developments in micromanufacturing processes & micro- manufacturing equipment. Papers are sought that address theoretical & applied research issues related to processes, systems and equipment for the manufacture, assembly and metrology that are required to create components and systems with 3D features in a wide range of materials.

     
 
  Program Topics:   Organized By:
 

• Products-applications-case studies
• Metrology and instrumentation
• Machine tools
• Net shape processes
• Material removal processes
• Process modeling/design
• Material modeling/simulation
• Sensors, actuators and control
• Micro- to nano-scale bridging
• Tooling and probes

Invited Speakers:
• S. Patterson, Lawrence Livermore Lab
• H. Ohmori, RIKEN, Japan
• S. Dimov, Cardiff Univ., UK

Invited Panelist:
• D. Bibber, Micro Engr. Solutions Inc.
• A. Honnegger, Microlution Inc.
• J. Randall, Zyvex Inc.

 
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